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Electron microscopy study of the impact of solution treatment on the corrosion behavior of an Al-Zn-Mg-Cu alloy
Tang, Huizhen1; Zhang, Yongchao1,2,4; Sun, Yanrong1; Wang, Shuai1; Yan, Lijuan1; Shen, Jun2,3; Ge, Binghui1,4
2024
摘要An Al-Zn-Mg-Cu alloy treated at 475 degrees C for 1 h was found to have improved corrosion resistance compared to non-solution-treated ones. Corrosion preferentially occurred in the matrix adjacent to second phases. Nonsolution-treated samples showed varying passive film thickness and uneven solute segregation along the metal/film interface, resulting in sites susceptible to localized corrosion. Solution treatment minimized second phases, promoted uniform passive film thickness and uniform solute segregation, generating a high density of nanoscale pits during early corrosion. Our results demonstrated the metal/film interface's crucial role in alloy corrosion, offering insights for improving corrosion resistance via heat treatments and interface engineering.
关键词Al -Zn -Mg -Cu alloy Solution treatment Passive film Corrosion behavior Segregation
DOI10.1016/j.corsci.2023.111665
发表期刊CORROSION SCIENCE
ISSN0010-938X
卷号226页码:10
通讯作者Zhang, Yongchao(yczhang@ahu.edu.cn) ; Ge, Binghui(bhge@ahu.edu.cn)
收录类别SCI
WOS记录号WOS:001112523500001
语种英语