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Competition between microstructural factors affecting growth of abnormally large grains in thin Cu foils
Guo, Jing1; Zhang, Chunlei2; Zoellner, Dana3; Li, Xin4,5; Wu, Guilin1; Huang, Tianlin1; Pantleon, Wolfgang6; Huang, Xiaoxu1; Jensen, Dorte Juul6
2024-12-01
摘要Grain boundary types and local boundary curvatures are generally considered to be important microstructural factors controlling grain boundary migration during grain growth. In this work, grain growth in thin copper foils is studied during annealing at a temperature of 1040 degrees C near the melting point by ex-situ experiments and Monte Carlo simulations. Few grains, stimulated by slight deformation at the sample edge, are observed to grow abnormally into the cube-oriented recrystallized microstructure with columnar grains spanning the foil thickness. The grain boundaries of these abnormally growing grains and the grain sizes in the adjacent polycrystalline recrystallized regions are analyzed. The experimental results suggest that spatial heterogeneities in the distribution of small recrystallized grains have a significant effect on the migrating boundaries. Potts model simulations confirm that grain boundary segments with small grains in front are more likely to migrate than segments facing coarser grains. The simulations also demonstrate the importance of grain morphology. Altogether, this work highlights the effects of a heterogeneous recrystallized microstructure on abnormal grain growth in thin foil samples.
关键词Abnormal grain growth Grain boundary migration Monte Carlo simulation Cu foil Ex-situ EBSD
DOI10.1016/j.actamat.2024.120339
发表期刊ACTA MATERIALIA
ISSN1359-6454
卷号281页码:12
通讯作者Huang, Xiaoxu(xiaoxuhuang@cqu.edu.cn) ; Jensen, Dorte Juul(doje@dtu.dk)
收录类别SCI
WOS记录号WOS:001313240400001
语种英语